HTI Precision Manufacturing

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HTI Product Development Capabilities / Equipment List

Photolithography

Polymer Etching/Removal/Treatment

  • Dry Film Lamination (Vacuum Panel & Hot Roll)
  • Liquid Resist Coating
  • Exposers (Glass or Mylar Phototools)
  • LDI Exposer (Maskless, 10 µm resolution, ± 12 µm alignment)
  • Photoresist Developing
  • Photoresist Stripping
  • Batch Vacuum Plasma Etch (NF3, O2, Ar standard, inquire regarding other materials)
    • 40 kHz 20 kW AC
    • 13.56 MHz 600W
  • Atmospheric Plasma Treatment
  • Triple Frequency YAG Raster Ablation (25-100 µm spot size, 355 nm)

Plating

Dielectric Coating (Base Dielectric/Covercoat)

  • Electroplating (Cu, Ni, Au standard, inquire regarding other materials)
  • Electroless plating (Ni standard, inquire regarding other materials)
  •  Spin Coating
  • Roller Coat
  • Dry Film Lamination (Vacuum Drawer & Hot Roll)
  • Slot Die

Vacuum Processing

Metal Etching

  • Thin Film Deposition (Conductive & nonconductive mtls)
  • 10 kW DC Magnetron PVD
  • 13.56 MHz RF PVD
  • Thermal Evaporation
  • Pretreat (Surface engineering)
  • 40 kHz 10 kW Glow Discharge
  • 2000 V Ion Gun
  • Materials:  Cu, SST, Platinum-Ir
  • Cr Microetch
  • Cu Microetch

 

 Precision Alignment and Assembly

Measurement / Characterization

  •  Fixture Aided Alignment
  • Vision Aided Alignment
  • Laser Welding
  • Resistance Welding
  • Pressure Sensitive Adhesive (PSA)
  • Liquid Adhesives (Manual/Automated Dispense)
  • Cutting / Shearing
  • Resist Thickness Measurement
  • High Magnification Optical Scope (25X - 1000X)
  • Metal Thickness (XRF)
  • Profilometer (Dektak Stylus)
  • Surface Conductivity (4-Point Probe)
  • Dynamic Contact Analyzer
  • Dage Microforce Mechanical Tester

Metal Forming / Adjust

Electrical Bonding / Termination

  • Forming (Using Hard Tooling)
  • Laser Geometry Adjust (Precision Adjust)
  •  Solder Bond
  • Ultrasonic Lead Bond
  • Gold Ball Bond

 

Laser Processing

Cleaning

  • Ablation
  • Welding
  • Surface Modification
  • Cutting & Drilling
  •  Deionized Water Ultrasonic Cleanline
  • Caustic Cleanline (NaOH)
  • cid Cleaning (HCl)

Thermal Treatment

Electrochemical Characterization

  • Batch cure ovens
  • Conveyorized IR oven
  • Potentiostat