HTI Precision Manufacturing

Circuit Fabrication Overview

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HTI Circuit Fabrication HistoryEtch_Line

  • Vertically integrated world leader in suspension assemblies for hard disk drives (HDD) for over 20 years
  • Technology:  Proven, high volume / yield, 1 mil line /space subtractive etching capability (12 µm Cu)
  • High Capacity / Low Cost:  Subtractive circuit etching capacity > 100K panels / month (HDD suspensions moving to new sub 1 mil line / space semi additive process)
  • Global Supplier:  HTI cost effectively supplies > 10 million suspensions /week to customers in Asia from the US

HTI has produced over 6 billion sub 2 mil line / space circuits for the hard disk drive industry!

 

 Manufacturing Capabilities

  • Photochemical Machining, Plasma Etching, Plating, Photoimageable Soldermask
  • Laser Direct Imaging
  • Glass photo-tool fabrication
  • Standard panel dimensions: 12"x27", 12"x18", 18" x 24", 20" x 24"
  • Std materials / thickness:
    • Cu:  9-35 µm (1 oz)
    • PI:  25 µm (1 mil) - 125 µm (5 mil)
  • Registration:  +/-12 µm (0.48 mil)
  • Feature Inspection:   100% automated vision inspection
  • Line Space:  25 µm (~1 mil) on 12 µm Cu (See table below for other thicknesses)

 LineSpaceChart

 CircuitExamples

Download your Circuit Fabrication Design Guide here