HTI Precision Manufacturing

Analytical Test Technologies

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Material Science Analysis

  • Gas Chromatography-Mass Spectrometry (GC-MS)
  • Field Emission Scanning Electron Microscopy (FESEM)
  • Electron Microscopy:  Focused Ion Beam (FIB)
  • Fourier Transform Infrared Spectroscopy (FTIR)
  • Metallography (Cross Sectioning)
  • Mechanical Testing with Advanced Video Non-Contact System (Instron 5866)
  • Optical Microscopy
  • Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES)
  • Total Organic Carbon (TOC)
  • Liquid Particle Counting (LPC)
  • Ion Chromatography (IC)
  • Nonvolatile Residue Analysis (NVR)
  • Differential Scanning Calorimetry (DSC)
  • Dynamic Mechanical Analysis (DMA)
  • ThermoMechanical Analysis (TMA)
  • Thermogravimetric Analysis (TGA)
  • Gel Permeation Chromatography / Size Exclusion Chromatography (GPC/SEC)
  • Ultraviolet Visible Spectroscopy (UV Vis)
  • Potentiometric Titration
  • Tribology (Pin on disk - wear)

 

Product Characterization / Test

 

 

 

 

  • Nanoindenting (Hysitron, MTS)
  • Corrosion / Environmental (Temp / Humidity) Cycling
  • Shock / Drop testing
  • Micro Force (Tensile, compression, peel)
  • Ultrasonic Cleaning Durability
  • Vibration Analysis (Non-Contact Scanning Laser Vibrometer)
  • High speed video analysis (100,000 frames / second)
  • Electrical Circuit Analysis (Time Domain Reflectometry, Conductivity, S-Parameter)
  • 3D Surface Analysis (White Light Inferometry)

 

Dimensional Metrology

  • Ultra Coordinate Measuring Machine (Zeiss UPMC)
  • Coordinate Measurement Machines (Leitz with enhanced accuracy)
  • Roundness/Runout (Zeiss RondCom)
  • Profilometry / Contour (Zeiss Surfcom)
  • Height (Heidenhain)
  • Laser Micrometer (Mitutoyo)